RF-S210 RF-S310 Soldering Station – Rapid Heating System
RF-S210 RF-S310 Soldering Station – Rapid Heating System
High-speed BGA soldering station designed for mobile phone motherboard repair and precision electronics work. Rapid heating, smart temperature control, and compact footprint for bench or field service.
Features
- Rapid heating system for fast tip recovery and reduced downtime.
- Smart temperature control for consistent solder joints on BGA and SMD components.
- Compact host (144mm × 96mm × 90mm) and lightweight design (985g) for easy placement.
- Suitable for mobile phone maintenance, PCB rework, and precision repairs.
- Durable construction for repeated professional use.
Technical Details
- Model: RF-S210 / RF-S310
- Host size: 144MM × 96MM × 90MM
- Net weight: 985G
- Certification: None stated
- High-concerned chemical: None
- is_customized: No
- Choice available: Yes
- Designed for: BGA, SMD, mobile phone mainte (repair)
Package Includes
- Soldering station unit (RF-S210 or RF-S310)
- Power cable and standard accessories
- Basic tip set and user guide
Warnings & Advice
- Hot surfaces and tips—use protective gear and allow cooling before handling.
- Work in a well-ventilated area and follow ESD precautions for sensitive electronics.
This soldering station improves repair speed and consistency by delivering rapid heat-up and precise temperature stability, reducing component damage and rework. It simplifies BGA and mobile-board maintenance, offering reliable performance for technicians and hobbyists alike.
Perfect for mobile repair shops, electronics technicians, and bench engineers—backed by reliable performance and a 2-year warranty.
Ready to upgrade your repair bench? Add the RF-S210 or RF-S310 to your toolkit to speed up rework jobs, improve solder quality, and get back to productive service faster.
Please note: All electronic and mechanical equipment, devices and machines sold to EU countries are CE certified and carry a two year warranty.